Laser Micromachining Systems & Contract Services
Custom Laser Systems, Laser Drilling, Laser Marking, Laser Cutting, Laser Etching, Laser Milling, Laser Stripping
|
Laser Micromachining Systems & Contract Services
Custom Laser Systems, Laser Drilling, Laser Marking, Laser Cutting, Laser Etching, Laser Milling, Laser Stripping |
|
|
Laser Micromachining Contract Services (Custom Laser Systems) The following are examples of a subset of the contract services provided by TeoSys Engineering. Whatever your requirements, our team of applications engineers can implement a solution. Please call or e-mail (sales@teosys.com) with your application needs. We perform precision micro milling, marking, stripping, drilling, and cutting on all hard to process materials. We also have a full capability machine shop on-site and are able to provide fabrication of larger pieces, micromachining of small features on the piece and quick turnaround for difficult micromachining part handling. Our video microscope allows accurate feature measurement for both our micromachining and 'macro' machining activities. Take a look at examples of our work below!! Examples of the materials on which we process: Plastics, Ceramics and Glass. Polyimide Polyurethane PEBAX Polystyrene Parylene Nylon Polycarbonate Alumina Zirconia Silicon Carbonate Pyrex Glass Diamond Quartz Fused Silica All colored gemstones Steel Stainless Steel Other Metals Organic Materials Laser Micro Marking Laser marking (direct write) of a 2D barcode on the bezel of a miniature microphone. Barcode is laser marked using a 2 micron spot size and is 50 microns square.
Laser direct write of a 2D barcode on the head of a stainless pin.
Data Matrix 2D barcodes laser marked using mask projection with a metal mask inside the laser cavity on rough DIAMOND at 50X magnification. The barcode is 30 microns square. This mask was machined at 1mm using the same laser system that later performed the intra-cavity mask projection. This mask is imaged from inside the laser as opposed to a contact mask which is placed on the work surface. Increasing laser energy on a mask projection application. Laser energy increases from 30% on the far left to 90% on the far right. Picture taken at 20X magnification. The entire barcode is 20 microns high. On the right is the mask which was micromachined out of POLYIMIDE at 1mm. The reason that we could use polyimide was the fact that our mask is placed inside of the laser cavity (patented process) and this causes very little or no damage to the mask. Unlike extra-cavity mask projection lasers which tend to destroy the mask as they are using it. The outer part of the square is laser marked using a direct write process. Laser Marking (Visible) Laser marking of parts for identification and serialization. Infrared wavelengths are used to mark the larger visible marks on products.
Laser Groove and Hole Drilling Laser hole drilling in a custom catheter for medical applications. TEFLON (PTFE) capillary tube - 30 um hole drilled at 193 nm through 1 mil wall thickness. This is one of the most difficult materials to micromachine. TeoSys was able to machine this material because our laser's superior beam quality, high energy density (fluence) and extensive experience with 193nm wavelength. Also shown is a polymer tube hole with a 50 micron hole.
Hole array drilling into stainless. The example below on the left is an array of 250 um holes drilled into 303 stainless steel. The picture ion the right is an 81.7um hole drilled through a silicon wafer.
The picture below is a 25 micron exit hole in 38micron thick stainless steel. We have full video microscope verification of feature size. TeoSys includes a copy of this feature size verification with the fabricated product for quality control purposes.
Below is a 38um thick kapton sheet which has a profiled hole drilled with a 120um entrance (on bottom) and a 30um exit (on top). Our video microscope provides feature measurement capabilities.
In process groove drilling in 5 inch diameter pyrex plate. Groove is 150um deep and 255um wide. Although processing time was multiple hours, the 193nm wavelength provided clean groove walls and groove floor flatness for this unusual and very large piece.
Micro Stripping & Laser Ablation 1 mil coating PARYLENE stripped 200X edge view
Laser Ablation: 10 micron metal alloy coating ablated from a 6 micron circular area on glass.  Laser Ablation: 1.27 micron wide strip of a metal alloy laser ablated from glass surface.
Sales:
sales@teosys.com |
Send mail to
teosys@teosys.com with
questions or
|
